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Joint development agreement for 3G chips |
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Tuesday, 13 July 2004 |
13 July, 2004: Renesas Technology Corp has signed an agreement
with NTT DoCoMo, Inc to jointly develop a single-chip LSI for dual-mode
handsets for third-generation W-CDMA and second-generation GSM/GPRS,
with the aim of promoting the global use of FOMA services. The
two companies will combine W-CDMA technology developed by NTT DoCoMo
with Renesas Technology's LSI fabrication, multimedia application
processor, and GSM/GPRS technologies, to achieve single-chip
implementation of a baseband LSI and SH-Mobile application processor
for dual-mode handsets. Major features of the new LSI are as follows. - Support for W-CDMA+GSM/GPRS dual-mode handsets
- Baseband LSI and SH-Mobile application processor on a single chip
- Use
of SH-Mobile third-generation CPU core (development project name: SH-X)
offering powerful multimedia application processing, including image,
audio, and Java(tm) capabilities, together with low power consumption
The
two companies plan to have a product ready in the first half of fiscal
2006. Renesas Technology will collaborate with NTT DoCoMo to offer
handset manufacturers a platform based on the new LSI and promote
worldwide use of FOMA services and reduce costs. Renesas Technology
also plans to provide this single-chip LSI for the UMTS market. www.renesas.com
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